GTU 3160004 FUNDAMENTAL OF SEMICONDUCTOR PACKAGE (SPMT) Summer 2026 Paper Solution & PDF
Question 2
Question 3
What are the differences between Non-destructive wire pull test and Destructive wire pull test?
Question 4
List at least 5 PFA ( Physical Failure Analysis )techniques and provide brief description of the same.
What is Passive Voltage Contrasting technique? Provide suitable example to explain the technique.
Describe the Focused Ion Beam technique and its fail modes. Compare it with X-sec technique
Question 5
What is the benefit of using the Foundation/Family approach when creating Control Plans?
What is ISO standard? What is the purpose of ISO standard? Explain ISO9000 family of standards?
Describe how FMEA (Failure Mode and Effects Analysis )helps mitigate risks and prevents Issues.
What are the roles of leaders and employees in implementing QMS and what are the benefits of implementing Quality Management System?
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About this Examination Paper & Attribution
Official Gujarat Technological University (GTU) examination paper and step-by-step solutions for FUNDAMENTAL OF SEMICONDUCTOR PACKAGE (SPMT) (Summer 2026, B.E. · Common Engineering, Sem 2). Features complete 70-mark regular & remedial examination pattern, official marking distribution across all 5 questions, and direct 1-click official PDF download.
Transcribed for student exam preparation from Gujarat Technological University official examination archives. Questions, syllabus guidelines, and curriculum marking schemes remain the intellectual property of Gujarat Technological University.