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Gujarat Technological UniversityWinter 2025 Examination

GTU 3160004 Fundamental of Semiconductor Package Manufacturing and Test (SPMT) Winter 2025 Paper Solution & PDF

B.E. · Common Engineering · Semester 2 · Subject Code: 3160004
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Total Marks70 MarksExternal theory exam
Passing Marks23 Marks33% minimum cutoff
Exam Duration2.5 Hours2:30 PM – 5:00 PM
Paper Structure5 QuestionsWith internal OR choices
Jump toQ1Q2Q3Q4Q5

Question 1

14 MarksMedium
(a)
What is packaging? Explain the need of packaging.
3 Marks
(b)
Enlist important package components with their usage.
4 Marks
(c)

Enlist and explain memory and storage package configurations and requirements with relevant diagrams.

7 Marks

Question 2

14 MarksMedium
(a)
Which are the types of adhesives used in the die attach process?
3 Marks
(b)
Explain die preparation stages in detail.
4 Marks
(c)

Explain different die stacking configurations with diagrams. Which factors influence the selection of stacking configuration?

7 Marks
OR OPTION
(c)
Enlist and describe Quality management principles in ATMP process.
7 Marks

Question 3

14 MarksMedium
(a)

What is the singulation process in packaging flow? Which is the technology used for the same?

3 Marks
(b)
Explain flip chip assembly process flow in detail.
4 Marks
(c)

What is Parametric Testing? Analyze the purpose of collecting Parametric Testing data.

7 Marks
OR OPTION
(a)
Explain common laser marking defects with examples.
3 Marks
(b)
Discuss Assembly Open/short test and final test in detail.
4 Marks
(c)

Explain yield in detail. What are the strategies used to increase yield of a memory product?

7 Marks

Question 4

14 MarksMedium
(a)
Which are the key performance indicators of ATE equipment?
3 Marks
(b)
Describe binning in ATE process flow.
4 Marks
(c)
Enlist and explain steps involved in the organic substrate manufacturing process.
7 Marks
OR OPTION
(a)

Explain following terms with respect to package reliability: 1)Failure rate 2)Mean time to failure 3)Mean time between failure

3 Marks
(b)
Explain and Compare TMCL and TST.
4 Marks
(c)
Explain package warpage, critical parameters and measurements.
7 Marks

Question 5

14 MarksMedium
(a)
Explain following terms with respect to statistical process control 1)Process stability
2)Process capability 3)Process variation
3 Marks
(b)
What is die attach film? Enlist major ingredients of DAF.
4 Marks
(c)
Explain electrical failure analysis in detail with different failure modes.
7 Marks
OR OPTION
(a)
Explain types of flux constituents and describe.
3 Marks
(b)
Discuss and evaluate Cost of Quality in detail.
4 Marks
(c)

Explain various steps of fault analysis with detailed flow. 07 Page 2 of

2 Marks
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About this Examination Paper & Attribution

Official Gujarat Technological University (GTU) examination paper and step-by-step solutions for Fundamental of Semiconductor Package Manufacturing and Test (SPMT) (Winter 2025, B.E. · Common Engineering, Sem 2). Features complete 70-mark regular & remedial examination pattern, official marking distribution across all 5 questions, and direct 1-click official PDF download.

Transcribed for student exam preparation from Gujarat Technological University official examination archives. Questions, syllabus guidelines, and curriculum marking schemes remain the intellectual property of Gujarat Technological University.

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