Question 1
List out any 3 package types from each category for common, advanced, and emerging package types
What is Encapsulation Process? What is its purpose? List down different types of encapsulation technique?
List out any 3 package types from each category for common, advanced, and emerging package types
What is Encapsulation Process? What is its purpose? List down different types of encapsulation technique?
What is Failure analysis? What are the broad categories of semiconductor device fails? Page 1 of
What are some of the differences between Design FMEA (DFMEA) and Process FMEA (PFMEA)
What are the roles of leaders and employees in implementing QMS and what are the benefits of implementing Quality Management System?
Describe the difference between Issues and Risks. Describe how FMEA helps mitigate Risks and prevents Issues.
Explain how cost of quality can help an organization improve its business performance and customer satisfaction. Provide examples of prevention, appraisal, internal failure, and external failure costs in your answer. Page 2 of
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Official Gujarat Technological University (GTU) examination paper and step-by-step solutions for Fundamental of Semiconductor Package Manufacturing and Test (SPMT) (Summer 2025, B.E. · Common Engineering, Sem 2). Features complete 70-mark regular & remedial examination pattern, official marking distribution across all 5 questions, and direct 1-click official PDF download.
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