Gujarat Technological UniversitySummer 2025 examination

GTU 3160004 Fundamental of Semiconductor Package Manufacturing and Test (SPMT) Summer 2025 Question Paper & PDF

B.E. · Common Engineering · Semester 6 · Subject code 3160004
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Total
70 marks
To pass
23 marks (33%)
Duration
2.5 Hours 10:30 AM – 1:00 PM
Questions
5 with internal choice
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6 of 25 questions on this paper were also asked in other years. Each is marked below with the years it appeared.See all 6 repeated 3160004 questions, most asked first

Q.1

14 Marks
(a)
3 marks

List out any 3 package types from each category for common, advanced, and emerging package types

(b)
4 marks
What is Semiconductor Packaging? Why is it needed?
(c)
7 marks

What is Encapsulation Process? What is its purpose? List down different types of encapsulation technique?

Q.2

14 Marks
(a)
3 marks
What is Gage Repeatability & Reproducibility?
(b)
4 marks
What is Burn In Test ? Draw the Burn Bath tub curve ?
(c)
7 marks
What are the limitations of 2D NAND ? What is the Advantage of 3D NAND ?
(c)
7 marksAsked in 2 of 3 papers
What is Parametric Testing? And why do we collect Parametric Testing data ?

Also asked in Winter 2025 Q3c

Q.3

14 Marks
(a)
3 marks
What does it means by TAL (time above liquid) in reflow profile?
(b)
4 marksAsked in 3 of 3 papers
What is DAF? Explain in detail its major ingredients.

Also asked in Summer 2026 Q3a, Winter 2025 Q5b

(c)
7 marksAsked in 3 of 3 papers
Explain the manufacturing process of organic substrates.

Also asked in Summer 2026 Q3c OR, Winter 2025 Q4c

(a)
3 marks
Describe reliability testing.
(b)
4 marks
Explain Storage life test(SLT).
(c)
7 marks
Describe 5 EMC ingredients and briefly explain its purposes

Q.4

14 Marks
(a)
3 marks
Write working and application of Time domain reflectometer (TDR).
(b)
4 marksAsked in 2 of 3 papers
Draw and explain the schematic for Basic FA(Failure analysis) Flow

Also asked in Summer 2026 Q4a

(c)
7 marks
How 3D X-ray technique is different compared to 2D-Xray technique?
(a)
3 marks
List down Physical failure analysis (PFA) techniques
(b)
4 marksAsked in 2 of 3 papers
What is a Curve Tracer and what are its applications?

Also asked in Summer 2026 Q4b

(c)
2 marks

What is Failure analysis? What are the broad categories of semiconductor device fails? Page 1 of

Q.5

14 Marks
(a)
3 marks
List different methods for ranking risks.
(b)
4 marks

What are some of the differences between Design FMEA (DFMEA) and Process FMEA (PFMEA)

(c)
7 marksAsked in 2 of 3 papers

What are the roles of leaders and employees in implementing QMS and what are the benefits of implementing Quality Management System?

Also asked in Summer 2026 Q5c OR

(a)
3 marks
Why Statistical Process Control is important in industry?
(b)
4 marks

Describe the difference between Issues and Risks. Describe how FMEA helps mitigate Risks and prevents Issues.

(c)
2 marks

Explain how cost of quality can help an organization improve its business performance and customer satisfaction. Provide examples of prevention, appraisal, internal failure, and external failure costs in your answer. Page 2 of

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About this paper

Official Gujarat Technological University (GTU) examination paper for Fundamental of Semiconductor Package Manufacturing and Test (SPMT) (Summer 2025, B.E. · Common Engineering, Sem 6). Features complete 70-mark regular & remedial examination pattern, official marking distribution across all 5 questions, and direct 1-click official PDF download.

Transcribed for student exam preparation from Gujarat Technological University official examination archives. Questions, syllabus guidelines, and curriculum marking schemes remain the intellectual property of Gujarat Technological University.

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